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Semiconductor device mechanical parts - List of Manufacturers, Suppliers, Companies and Products

Semiconductor device mechanical parts Product List

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Glass epoxy (Galaepo) molding processing for semiconductor device mechanical components.

The pipes made using the hand lay-up method are also ideal for mechanical parts that require geometric tolerances.

Components used in semiconductor devices require high-precision processing. This product is made from a glass-epoxy pipe created using the hand lay-up method, which has been machined using a CNC lathe and machining center, and has undergone keyway processing. As it is a component used for shafts, geometric tolerances are required for the inner diameter holes, which were made slightly smaller and then machined using a CNC lathe. The pipes made using the hand lay-up method have uniform stress, and due to their mechanical strength and dimensional stability, they can be processed with high precision without distortion. We have a proven track record in a wide range of fields and applications, from custom-made products used in heavy electrical, railway, and telecommunications to reinforcement plates for electronic components' FPCs, so please feel free to consult with us.

  • Processing Contract

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